The 3rd International Conference on Heat Transfer Devices (ICHTD'18) aims to become the leading annual conference in fields related to heat transfer devices. The goal of ICHTD'18 is to gather scholars from all over the world to present advances in the relevant fields and to foster an environment conducive to exchanging ideas and information. This conference will also provide an ideal environment to develop new collaborations and meet experts on the fundamentals, applications, and products of the mentioned fields.

ICHTD is an acronym for International Conference on Heat Transfer Devices.


Submissions in the form of extended abstracts, short papers, and full manuscripts are welcome.

  • all submitted papers will be peer-reviewed
  • the congress proceedings will be published under an ISSN and ISBN number
  • each paper will be assigned a unique DOI number by Crossref
  • the conference proceedings will be indexed by Google Scholar
  • the proceedings will be permanently archived in Portico (one of the largest community-supported digital archives in the world).
  • selected papers from the congress will be submitted for possible publication in the Journal of Fluid Flow, Heat and Mass Transfer (JFFHMT) (publication fees may apply)

To learn more about the previous event in this conference series, please visit: Past Event.

Paper Topics

ICHTD'18 is now accepting papers on the following topics.

  • Boilers and Condensers
  • Design and Simulation
  • Experimental Measurements
  • Heat Exchanger Fundamentals and Design
  • Heat Exchangers with Chemical Reaction
  • Heat Transfer Enhancement
  • Mechanical Design
  • Multiphase Heat Exchangers

For a complete list of the paper topics, please visit: Submissions.

Keynote Speakers:

Dr. Sanjeev Chandra,
University of Toronto, Canada
Biography & Abstract

ICHTD'18 is part of the 3rd World Congress on Momentum, Heat and Mass Transfer (MHMT'18).
Congress Website | Congress Flyer

Poster Board Dimensions:
Authors presenting via poster boards are to be informed that poster boards are 110 cm height and 70 cm width.

Upcoming Dates

Mar. 13, 2018
Final Version of Accepted Submissions Deadline
Mar. 13, 2018
Regular Registration
Apr. 12 - 14, 2018
Conference Dates

Google Scholar